Technology | PiCool Technologies

The Challenge & Innovation

Modern electronics—from AI chips to power inverters—are pushing the limits of traditional cooling methods. At PiCool Technologies, we've developed a breakthrough evaporative cooling system using fiber-based membranes with active pumping. Our technology delivers ultra-high heat flux performance (>500 W/cm²) while being scalable, efficient, and integration-ready.

How it works

Evaporative Cold Plate

Uses a fiber-based membrane with 3D interconnected pores to maximize thin-film evaporation area.

Phase-Change Cooling

Leverages the high latent heat of vaporization for energy-efficient cooling at extreme thermal loads.

Active Liquid Pumping

Optimized flow ensures continuous liquid supply and efficient vapor removal

High cooling performance

Capable of dissipating extreme heat loads (>800 W/cm²), ideal for next-generation chips, AI accelerators, and power electronics.

Low cost

Constructed with scalable, cost-effective materials and processes such as fiber membrane fabrication and standard fluid components.

Low power consumption

Uses optimized fluid flow and phase-change cooling to achieve superior thermal performance with minimal pumping energy.

Modular and scalable

Easily integrated into various system sizes and configurations, from individual chips to full server racks and industrial power modules.

Key features

Validation and Development

Core technology developed at UC San Diego with pending patents

Validated through peer reviewed journal publications

Currently in Phase I prototyping and testing

Targeting Phase II pilots with HPC and cloud partners